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TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g /

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Buy cheap TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK from wholesalers
  • Buy cheap TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK from wholesalers
  • Buy cheap TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK from wholesalers
  • Buy cheap TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK from wholesalers
  • Buy cheap TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK from wholesalers

TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK

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Brand Name:ZIITEK
Model Number:TIF100-20-05S
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:3-5work days
Company Data
Verified Supplier
Contact Person Dana Dai
Business Type: Manufacturer
Officials: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality: Quality Certifitation Available
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Product Details Company Profile
Product Details

TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK​


The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.



Features:


> Good thermal conductive: 2.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF100-20-05S Series
Color

Blue

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
27/35/45/60
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77

Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

1.91

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16

120mils / 3.048 mm

2.29

Dielectric Breakdown Voltage
>1500~>5500 VACASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05

200mils / 5.080 mm

3.14

Thermal conductivity
2.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK

TIF100-20-05S Datasheet-REV02.pdf

Company Profile

Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

 

Ziitek D-U-N-S® Number: 656191068

 

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